This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specif
Pages: 1048
Category: Ingenjörsvetenskap
e-ISBN: 9781135536848
Shipping weight: 1.2 kg
Ships in: 1-2 days
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