The large scale integration and planar scaling of individual system chips is reaching an expensive limit. If individual chips now, and later terrabyte memory blocks, memory macros, and processing cores, can be tightly linked in optimally designed and processed small footprint vertical stacks, then performance can be increased, power reduced and cost contained. This book reviews for the electronics industry engineer, professional and student the critical areas of development for 3D vertical memory chips including: gate-all-around and junction-less nanowire memories, stacked thin film and double gate memories, terrabit vertical channel and vertical gate stacked NAND flash, large scale stacking of Resistance RAM cross-point arrays, and 2.5D/3D stacking of memory and processor chips with through-silicon-via connections now and remote links later.
Key features:
- Presents a review of the status and trends in 3-dimensional vertical memory chip technologies.
- Extensively reviews advanced vertical memory chip technology and development
- Explores technology process routes and 3D chip integration in a single reference
Pay easily by card, Klarna, Apple Pay or Google Pay. Not happy? You always have a 14-day money-back guarantee. Read more in our terms. If you have any questions, email us at hello@memmo.org.
Memmo makes studying easier – wherever you are in the world. We bring your course books and smart study tools together in one place: summaries, quizzes, podcasts and flashcards. Plus Ted, your study buddy who answers anything you wonder. Over 50,000 students already study here – built to help you learn faster and stress less.