The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.
Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies.
This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies.
This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Betal enkelt med kort, Klarna, Apple Pay eller Google Pay. Ikke fornøyd? Du har alltid 14 dagers angrerett. Les mer i våre vilkår. Har du spørsmål, send oss en e-post på hello@memmo.org.
Memmo gjør det enklere å studere – uansett hvor du er i verden. Hos oss samler du pensumbøker og smarte studieverktøy på ett og samme sted: sammendrag, quizer, podkaster og flashcards. Og så Ted, din studiekompis som svarer på alt du lurer på. Over 50 000 studenter studerer allerede her – bygget for at du skal lære raskere og stresse mindre.