The large scale integration and planar scaling of individual system chips is reaching an expensive limit. If individual chips now, and later terrabyte memory blocks, memory macros, and processing cores, can be tightly linked in optimally designed and processed small footprint vertical stacks, then performance can be increased, power reduced and cost contained. This book reviews for the electronics industry engineer, professional and student the critical areas of development for 3D vertical memory chips including: gate-all-around and junction-less nanowire memories, stacked thin film and double gate memories, terrabit vertical channel and vertical gate stacked NAND flash, large scale stacking of Resistance RAM cross-point arrays, and 2.5D/3D stacking of memory and processor chips with through-silicon-via connections now and remote links later.
Key features:
- Presents a review of the status and trends in 3-dimensional vertical memory chip technologies.
- Extensively reviews advanced vertical memory chip technology and development
- Explores technology process routes and 3D chip integration in a single reference
Betal enkelt med kort, Klarna, Apple Pay eller Google Pay. Ikke fornøyd? Du har alltid 14 dagers angrerett. Les mer i våre vilkår. Har du spørsmål, send oss en e-post på hello@memmo.org.
Memmo gjør det enklere å studere – uansett hvor du er i verden. Hos oss samler du pensumbøker og smarte studieverktøy på ett og samme sted: sammendrag, quizer, podkaster og flashcards. Og så Ted, din studiekompis som svarer på alt du lurer på. Over 50 000 studenter studerer allerede her – bygget for at du skal lære raskere og stresse mindre.