The large scale integration and planar scaling of individual system chips is reaching an expensive limit. If individual chips now, and later terrabyte memory blocks, memory macros, and processing cores, can be tightly linked in optimally designed and processed small footprint vertical stacks, then performance can be increased, power reduced and cost contained. This book reviews for the electronics industry engineer, professional and student the critical areas of development for 3D vertical memory chips including: gate-all-around and junction-less nanowire memories, stacked thin film and double gate memories, terrabit vertical channel and vertical gate stacked NAND flash, large scale stacking of Resistance RAM cross-point arrays, and 2.5D/3D stacking of memory and processor chips with through-silicon-via connections now and remote links later.
Key features:
- Presents a review of the status and trends in 3-dimensional vertical memory chip technologies.
- Extensively reviews advanced vertical memory chip technology and development
- Explores technology process routes and 3D chip integration in a single reference
Betaal eenvoudig met kaart, Klarna, Apple Pay of Google Pay. Niet tevreden? Je hebt altijd 14 dagen bedenktijd. Lees meer in onze voorwaarden. Heb je vragen, mail ons dan via hello@memmo.org.
Memmo maakt studeren makkelijker – waar je ook bent ter wereld. Wij brengen je cursusboeken en slimme studietools samen op één plek: samenvattingen, quizzen, podcasts en flashcards. En Ted, je studievriend die antwoord geeft op alles wat je je afvraagt. Meer dan 50.000 studenten studeren hier al – gebouwd om je sneller te laten leren en minder stress te geven.