Artificial Plasmonics for VLSI Interconnects

Build the microchips of the future with this revolutionary new information transfer technology

Advancements in high-performance computing have continually demanded for progress in disruptive technological research and innovations. Moore’s Law has pushed the Very Large Scale Integration (VLSI) technology to pack MOS devices inside a chip at an exponential rate, thereby surpassing now eight billion transistors per cm2. This has concomitantly fueled the growth of multilayered on-chip interconnects comprising metallic and low dielectric materials.

Artificial Plasmonics for VLSI Interconnects introduces a new method for improving chip performance by harnessing the power of information transfer among chips at terahertz frequency. This revolutionary new electromagnetic wave engineering, called a spoof surface plasmon polariton, adapts the principles of VLSI and terahertz interconnect technology along with the artificial plasmonics to transfer huge quantities of data at vastly improved speeds. It constitutes a potentially decisive contribution to the pursuit of faster and more capacious VLSI chips.

In Artificial Plasmonics for VLSI Interconnects, readers will also find:

• A cutting-edge new approach supported by pioneering research
• Detailed discussion of essential components related to the development of THz interconnect technology, including theory, modeling, simulation, and validation
• Roadmap to future technological development in the branch of artificial plasmonics

Artificial Plasmonics for VLSI Interconnects is ideal for engineers, researchers, and scientists working in electronics, electromagnetics, and optics.