The large scale integration and planar scaling of individual system chips is reaching an expensive limit. If individual chips now, and later terrabyte memory blocks, memory macros, and processing cores, can be tightly linked in optimally designed and processed small footprint vertical stacks, then performance can be increased, power reduced and cost contained. This book reviews for the electronics industry engineer, professional and student the critical areas of development for 3D vertical memory chips including: gate-all-around and junction-less nanowire memories, stacked thin film and double gate memories, terrabit vertical channel and vertical gate stacked NAND flash, large scale stacking of Resistance RAM cross-point arrays, and 2.5D/3D stacking of memory and processor chips with through-silicon-via connections now and remote links later.
Key features:
- Presents a review of the status and trends in 3-dimensional vertical memory chip technologies.
- Extensively reviews advanced vertical memory chip technology and development
- Explores technology process routes and 3D chip integration in a single reference
Zahle einfach mit Karte, Klarna, Apple Pay oder Google Pay. Nicht zufrieden? Du hast immer ein 14-tägiges Widerrufsrecht. Lies mehr in unseren AGB. Hast du Fragen, schreib uns eine E-Mail an hello@memmo.org.
Memmo macht das Lernen einfacher – wo auch immer du bist. Bei uns findest du deine Kursbücher und smarte Lerntools an einem Ort: Zusammenfassungen, Quizzes, Podcasts und Lernkarten. Und Ted, dein Lernbuddy, beantwortet alles, was du wissen möchtest. Über 50.000 Studierende lernen bereits hier – gemacht, damit du schneller lernst und weniger Stress hast.