Cała literatura kursowa, której potrzebujesz do studiów z Engineering. Znajdziesz tu szeroki wybór e-booków z Engineering. Nie możesz znaleźć tego, czego szukasz? Szukaj po ISBN, tytule lub autorze.
10 000 Książek
81st Conference on Glass Problems
S. K. Sundaram
2219 kr
Design for Embedded Image Processing on FPGAs
Donald G. Bailey
1008 kr
Quality Planning and Assurance
Herman Tang
1201 kr
Arc Welding Processes Handbook
Ramesh Singh
1760 kr
Applications and Metrology at Nanometer-Scale 2
Abdelkhalak El Hami, Philippe Pougnet, Pierre-Richard Dahoo
1421 kr
Tribology and Characterization of Surface Coatings
Sarfraj Ahmed, Vinayak S. Dakre
Power Electronics, A First Course
Ned Mohan, Siddharth Raju
1045 kr
Electromagnetic Waves 2
Pierre-Noël Favennec
Na-ion Batteries
Laure Monconduit, Laurence Croguennec
Intelligent Green Technologies for Sustainable Smart Cities
Abhishek Kumar, Souvik Ganguli, Suman Lata Tripathi, Tengiz Magradze
1604 kr
5G Technology
Antti Toskala, Harri Holma, Takehiro Nakamura
834 kr
Defect Assessment for Integrity Management of Pipelines
Y. Frank Cheng
1541 kr
Embedded Control for Mobile Robotic Applications
Arunkumar G. K., Leena Vachhani, Pranjal Vyas
1054 kr
Meshfree and Particle Methods
J. S. Chen, Michael Hillman, Ted Belytschko
1124 kr
Planar Microwave Sensors
Ferran Martín, Jonathan Muñoz-Enano, Lijuan Su, Paris Vélez
1097 kr
Flow-Induced Vibration Handbook for Nuclear and Process Equipment
Colette E. Taylor, Michel J. Pettigrew, Nigel J. Fisher
1247 kr
Introduction to Aerospace Engineering
Ethirajan Rathakrishnan
1100 kr
Renewable Energy Systems
Nikita Gupta, Sandeep Kumar, Sanjay Kumar, Subho Upadhyay
2054 kr
Safety and Health for Engineers
Roger L. Brauer
1256 kr
Multimedia Streaming in SDN/NFV and 5G Networks
Alcardo Barakabitze, Andrew Hines
1058 kr
Plastics Process Analysis, Instrumentation, and Control
Johannes Karl Fink
2008 kr
Petroleum Refining Design and Applications Handbook, Volume 3
A. Kayode Coker
2668 kr
Design of Three-phase AC Power Electronics Converters
Fei "Fred" Wang, Ruirui Chen, Zheyu Zhang
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
Beth Keser, Steffen Kröhnert
