3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

Autor: Lih-Tyng Hwang, Tzyy-Sheng Jason Horng
Wydawca: Wiley
Wydanie: 1
Data publikacji: 2018
ISBN: 9781119289647

Wybierz, jak chcesz czytać

0

Zapłać z Klarna
14-dniowa gwarancja zwrotu pieniędzy

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments

  • Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility
  • Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab
  • Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail
  • Provides chapter-wise review questions and powerpoint slides as teaching tools

Może Ci się spodobać