Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems
MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration.
You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks.
Readers will also benefit from the inclusion of:
Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
Paga facilmente con carta, Klarna, Apple Pay o Google Pay. Non sei soddisfatto? Hai sempre 14 giorni per il rimborso. Leggi di più nei nostri termini. Per qualsiasi domanda, scrivici a hello@memmo.org.
Memmo rende lo studio più facile, ovunque tu sia nel mondo. Qui trovi i tuoi libri di testo e strumenti di studio intelligenti, tutto in un unico posto: riassunti, quiz, podcast e flashcard. E poi c'è Ted, il tuo compagno di studio che risponde a ogni tua domanda. Oltre 50.000 studenti studiano già qui: è stato creato per aiutarti a imparare più velocemente e a stressarti meno.